Onsite Training
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BGA Rework Repair
Working on SMT assemblies can involve prototyping, test, production and the repair of assemblies in the field. This course presents to you for the first time an objective view and understanding about how to work on your SMT assemblies. With the proper understanding, the damage to components and to the boards are greatly minimized providing for an immediate payback to your company by reducing the repair/rework time and scrap rates. Who Would Benefit All those involved in doing BGA removal and replacement will be interested in this class including engineers, technicians and assemblers. Students who benefit from this course do not have to have had previous soldering experience. Some of our best students have never soldered before. Course Outline BGA Packages Presentation will discuss the different package options, including plastic, tape and ceramic packages. For these parts, the lead styles, eutectic solder, no-eutectic solder and columns are discussed and the reasons for the packages, their uses and their sensitivities in doing rework are discussed. PC Boards Boards have a big impact on the profiles and time necessary for removal. Therefore different board constructions will be discussed and the impact on BGA rework. Flux The impact flux has on the reflow profile will be discussed and what are the trends and reasons for using certain types in our industry. Reflow Profile Steps In any reflow profile certain steps are always used in the removal or replacement of BGA parts. Discussions will focus on the factors that determine the profile and how we would go about setting it up. Reflow Profile Setup Once the profile has been determined it is vital to know how to measure to see if the system is doing what you have identified as needing. To understand this, some case studies will be reviewed to gain insight into how to do this. Removal and Replacement Using a BGA rework system, each student is monitored during the lab to point out the what they can do to improve their techniques and get better results. Parts used in the lab include a host of chip resistors and capacitors, tantalum caps, transistors and diodes, assorted PLCC's, and assorted QFP's including QFP-208 0.5mm pitch. If the company request it there can be evaluations made of each person during the soldering lab. Course Materials: BGA, COB and Flip Chip PCB Design Manual Instructor: James C. Blankenhorn  |
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