1.1 What is the Industry Size?

1.2 What is the Industry Breadth?

1.3 What you do is important

1.4 Where is the Market?

1.5 How about Electronics and the Environment?

1.6 A Major Change?

1.7 What is the WEEE Directive?

1.8 List the Categories of Electronics Included

1.9 What is the RoHS Directive?

1.10 List the Categories of Electronics Included

1.11 What are the RoHS Exemptions?

1.12 So what does this mean?

1.13 What are some of the Logistical Concerns?

1.14 What are the steps you can take?

1.15 What about China RoHS?

1.16 What about USA RoHS?

1.17 What are Japanese “Green” Products?

1.18 Why is Pb-free is only a piece of RoHS Compliance

2.1 Solder as it is Today

2.2 List the Desirable Pb-free Characteristics

2.3 List the Pb-free Paste Options

2.4 What is the impact on Paste Costs?

2.5 What are Drop-in Solutions?

2.6 List some of the Pb-free Paste Options

2.7 What is the problem with 91Sn9Zn?

2.8 What is the problem with 96.5Sn3.5Ag?

2.9 How about SAC Alloys?

2.10 How about SnAgCuSb?

2.11 How about 58Sn42Bi?

2.12 How about SnAgBi?

2.13 What are the SnAgBi Concerns?

2.14 What looks like the Industry Choice?

2.15 What are the SAC Concerns?

2.16 What are the Things to Remember?

3.1 What are the Environmental Implications?

3.2 List the Sources of Environmental Lead

3.3 Why Target Pb in WEEE?

3.4 What about Pb-Free Solder Alloys?

3.5 What is The Decision?

3.6 Is Pb-Free a good thing?

4.1 Why worry about reliability?

4.2 What about Thermal Cycling Performance?

4.3 What about Thermal Fatigue for BGAs?

4.4 What about creep?

4.5 What does Isothermal Mechanical Cycling include?

4.6 When is Out of Plane Bending a problem?

4.7 Describe Mechanical Shock?

4.8 Summarization of the technical considerations

5.1 What do you need to know about Pb-free Components?

5.2 What are the Component Finish Options?

5.3 What about Sn Whiskers: Growth? 41

5.4 What about Sn Whiskers: Intermetallic Formation?

5.5 What is Copper Diffusion: Increasing Whisker Growth?

5.6 What is the Whisker Index?

5.7 Explain about Sn Whiskers: CTE Mismatch

5.8 What about Sn Whiskers: Other Causes?

5.9 What about Sn Whiskers: Mitigation?

5.10 What about Reliability of Various Component Finishes?

5.11 How to make the switch

5.12 How about Forward/Backward Compatibility?

5.13 What about Component Suppliers?

5.14 What are the Labeling Issues?

5.15 What are Other Component Concerns?

5.16 List Other Component Concerns

5.17 What is the Cost Impact?

6.1 Why the Surface Finish Requirements?

6.2 What is the Industry Choice for Surface Finish?

6.3 What about Pb-free HASL? (Hot Air Solder Level)

6.4 What about ENIG? (Electroless Nickel Immersion Gold)

6.5 What about using OSP? (Organic Solder Preservatives)

6.6 What about using IAg? (Immersion Silver)

6.7 What about using ISn? (Immersion Tin)

6.8 Surface Finish Comparison

6.9 Summary of different finishes

7.1 What is Conductive Anode Filament Growth (CAF)?

7.2 What causes Tombstoning?

7.3 What are the Tombstoning Rates?

7.4 What can be done to Minimize Tombstoning?

7.5 What about Mixed Alloys?

7.6 What is Voiding?

7.7 How do the Alloys Compare for Voiding?

7.8 How can you prevent Voiding in Reflow?

7.9 What causes Voids in Vias?

7.10 What are the Inspection Issues?

8.1 What is the European Lead Free survey?

8.2 What about the ELFNET Survey?

8.3 What is the Current status of EU Pb-Free?

8.4 Where is a Pb-Free Readiness Assessment Tool?

8.5 What is the Pb-free RAT?

8.6 WEEE/RoHS Experts are valuable

8.7 What to Think about for your BOM?

8.8 How do you Work with your suppliers?

8.9 How to go about Choosing a new Paste?

8.10 What percent are RoHS compliant suppliers?

8.11 What are Homogenous Materials?

8.12 How do you do Planning for Review?

9.1 What is the Approximate Distribution of Process Related Defects?

9.2 How Many Factors Affect your Print Quality?

9.3 What is Motorola’s Process Criteria?

9.4 How do you do a Paste Evaluation and Selection Strategy?

9.5 What items are Related to your Paste Selection?

9.6 What are Paste Responses?

9.7 What is the Paste Evaluation?

9.8 What’s the 12 Board Paste Evaluator?

9.9 What are the Effects of Viscosity?

9.10 What are the effects of Viscosity and Temperature?

9.11 What is the Motorola Flux Tackiness Measurement?

9.12 What is the effect on Solder Paste Stencil Life?

9.13 What are the Effects of Short Stencil Life?

9.14 What was the objective of the Motorola Stencil Printing Evaluation?

9.15 What was the results of Response to Pause Test?

9.16 What are the Effects of Poor Response to Pause?

9.17 How do you go about Measuring Shear Thinning Effect?

9.18 What is the Solder Paste resistance to Shear Thinning?

9.19 Why worry about Solder Balls in Passive Assembly?

9.20 What are Poor Gasketing results?

9.21 Why the Importance of Wall/Pad Ratio?

9.22 What changes for Stencil Design?

10.1 What is the Approximate Distribution of Process Related Defects?

10.2 What is crucial for Pb-free Reflow?

10.3 What are the (Old) RDRP Profiles?

10.4 What changes for the (New) Convection Ovens?

10.5 What is unique about the (Old) IR Oven Profile Design?

10.6 What is different about the (New) Convection Oven Profile Design?

10.7 What are the unique Profiles and Defect Mechanisms?

10.8 Explain Defect Mechanism Analysis 1

10.9 Explain Defect Mechanism Analysis 2

10.10 Explain Defect Mechanism Analysis 3

10.11 Explaining Defect Mechanism Analysis 4

10.12 Explaining Defect Mechanism Analysis 5

10.13 Explaining Defect Mechanism Analysis 6

10.14 Explaining Defect Mechanism Analysis 7

10.15 Explaining Defect Mechanism Analysis 8

10.16 Reflow Profile Summary

10.17 Recap of the Motorola Reflow Profile Evaluation

10.18 What was the Coalescence?

10.19 Compare Reflow Profile and Coalescence

10.20 How about the Wetting?

10.21 State Motorola’s Conclusion

11.1 Understand the Reliability of Pb-free

11.2 What was the Motorola Reliability Evaluation?

11.3 What was the Motorola Test Vehicle?

11.4 What was the Motorola Drop Evaluation?

11.5 What was the Motorola Thermal Shock Evaluation?

12.1 Which components get Wave Soldering?

12.2 List some Pb-free Wave Challenges

12.3 What is Tin Pest?

12.4 When does Tin Corrosion occur?

12.5 What are the industry Pb-free Wave Recommendations?

12.6 What is crucial about Fluxing?

12.7 List the Pb-free Wave Setup Rules of Thumb

12.8 How do you Calculate Dwell Time?

12.9 What is the Pin-in-Paste (PIP) Process?

12.10 What are the PIP Concerns?

12.11 How do you do the PIP Stencil Design?

12.12 What are PIP Stencil Design Steps 1 & 2?

12.13 What is PIP Stencil Design Step 3?

12.14 What is PIP Stencil Design Step 4?

12.15 Show some Common PIP Stencil Designs

12.16 Show a Poor PIP Stencil Design

12.17 What are Solder Preforms?

12.18 What are some PIP Considerations?

12.19 What to consider in PIP Solder Paste Selection?

12.20 What is an option for PIP Stencil Printing?

12.21 What about PIP Component Selection?

12.22 State the Pb-free Wave & Alternative Soldering Methods Summary