Table of Contents
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Table of Contents
Section 1 Component Package Specs & Tolerances This introductory section sets a foundation of knowledge about miniaturization in packaging by looking at products where very high density design is sometimes used, the industry standards for packages, dimensioning and tolerances, types of plating, IPC specs for workmanship, active components packages and passive components down to 0201's. Section 2 High Speed Design Considerations To achieve high speed there has been constant evolution in semiconductor technology coupled with new innovative packaging. All this matters little if the most important contributors to noise - reflections and coupling - are not understood. This section presents an overview of both reflections and coupling and the design errors that contribute to causing each. Section 3 Printed Circuit Boards Understanding printed circuit boards is key to successful design of high speed circuits and assemblies where miniaturized packages are mixed with traditional SMT. In this section you will learn how a board is fabricated and key issues that require attention including stacking order, hole sizes, trace widths, panelization, depanelization, fiducials, warpage, dimensional stability, and more. Section 4 Density Studies & Research There have been studies performed within the industry that are part of the information vital to understanding very high density design limitations due to process and assembly limitations. As well there are many high volume products where very high density design concepts have been applied and used successfully. Each step of the process is looked for potential issues. Section 5 Land Patterns To achieve the very high density design level means that land patterns must be reviewed as to how small the lands can become and not pose assembly, workmanship and reliability issues. In this section current patterns are investigated to see where and how they may be reduced to provide minimal or filletless lands. Lead styles for various packages are reviewed and discussed as to whether reduction in land pattern sizes are feasible or not including plastic and ceramic leadless devices. Section 6 Placement Rules for Dense Designs For new very high density designs the placement of components has to be closer than ever before. In this section production assemblies that have been disassembled and reviewed and presented along with new placement guidelines for components and test points that are not offered anywhere else. Section 7 Dense Assembly Requirements Each part and element in the assembly must be investigated form boards to each step in the SMT process to understand where and what the issues are when integrating miniaturized packages with traditional SMT. If proper consideration and understanding is not present the yields of these products will suffer dramatically. Section 8 Implementation The successful implementation of the design guidelines and information within this book is summarized and put into logical steps for consideration for implementation.  |
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