Publication
|
Check Cart/Check Out Troubleshooting the surface mount process involves several aspects. First there is a requirement to understand what is judged to be good vs. bad. For an electronic manufacturing process, such as the soldering of surface mount components to printed circuit boards, this involves what is commonly called workmanship standards. The next requirement then is to understand data collection techniques and statistical process control (SPC) methods, to collect meaningful data on the problems and other aspects of the process. Finally we need to be able to establish cause and effect relationships of problems. One can then quantify the problem vs. corrective action costs. This book is written to enhance one's ability to understand workmanship standards, troubleshooting techniques, and cause-and-effect relationships. To be able to understand and develop the cause-and-effect relationship of problems, it is also necessary to understand more about surface mount components, printed circuit boards, and the basic process. The first chapter of this book provides an overview of the major components families and some of the issues that are important for finding and preventing problems. Following this chapter there are successive chapters on printed circuit boards (PCBs) manufacturing process flows and details, test, and inspection. There are chapters discussing the details of workmanship guidelines and troubleshooting methods. This latter chapter includes both SPC methods and useful information in an "artificial intelligence/expert system" format. It represents several years of working with SMT and solving problems to increase yield. It summarizes the important points to understand to facilitate troubleshooting in a methodical and successful manner. Troubleshooting in the context of this book means more than just "finding and fixing" defects. It also means the prevention of defects, as it is well known that rework/repair processes, even performed with the best of equipment and procedures, introduces some reliability risk. Also, troubleshooting means reducing cost and operating more efficiently, so there are many tips are included to achieve a better product at lower cost. This book is written at the intermediate or advanced level and is an extension of my introductory level book titled: "Understanding and Using Surface Mount and Fine Pitch Technology", which you may find helpful on some of the background details. Who Will Benefit For personnel involved in working on SMT assemblies and would like to know what the causes of defects are so they can be solved such as QA, Process Engineers, and equipment maintenance personnel this is the book for you. Table of Contents Author Authors: Charles Hutchins, PhD Edition: January, 1997 Pages: 100 pages 8.5" x 11" ISBN#: 1-882812-38-7  |
| Copyright © 2004, SMT Plus Inc. |
