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This book has been updated to present information about the consant evolution of packaging into smaller, high-density packages, and how to design these packages into new advance level products. The first section of this book serves as an introduction to the packaging technologies available for designers. Section 2 presents important information about boards and assembly. Section 3 is all about flex circuitry materials. Flex will play a major role in some future solutions. Section 4 explains about land patterns and how to create them for the new BGA and CSO packages. Section 5 is design for manufacturability. The last section, section 6, covers documentation for assembly and fabrication.
Take your time and read through this publication. It is loaded with insight and should help you in your next generation designs. Who will Benefit This book will be of immense value to both circuit designers as well as CAD designers, and those involved in product testing, fabrication, troubleshooting and debug of high-speed products. Table of Contents Author Author: James C. Blankenhorn Printed: 2001 Pages: Full color 127 pages8.5" x 11" ISBN#: 1-882812-15-8  |
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